Semiconductor Wafer Polishing and Grinding Equipment Market 2022-2027 Report provides the latest industry data on market status, market share, growth rate, competition landscape, future trends, budget allocation and key challenges, sales channels, and distributors.
“Semiconductor Wafer Polishing and Grinding Equipment Market” (2022) research report gives granular analysis of the market size, share, segmentation, revenue, geographic regions of the market and forecasts to 2027. This report categorizes the market based on market overview, regions, analysis by types and applications, market dynamics and manufacturers profiles. Semiconductor Wafer Polishing and Grinding Equipment Market watch out for new highest revenue Study Reports with Top Countries Data, Current Trends, Future Estimations and Opportunity Analysis. The market is expected to grow considerably in upcoming Years.
The semiconductor wafer polishing and grinding equipment market is expected to register a CAGR of 6.68% over the forecast period (2021 – 2027).
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Company Coverage: –
– Applied Materials
– Ebara
– Lapmaster
– Logitech
– Entrepix
– Revasum
– Tokyo Seimitsu
– Logomatic
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Market Players Competitor Analysis:
The scope of the report, includes insights about several products offered by major players. The end-user segment, includes foundries, Interlevel Dielectric Material (IDM), and memory manufacturers. The regions included in this study are North America, Europe, Asia-Pacific, Latin America, and Middle East and Africa.
Traditional polishing and grinding equipment are becoming obsolete, and vendors are anticipating one stop solutions that could slice, probe, and polish in a single assembly line, instead of using multiple machines that occupy a lot of land space and require high budget installation and heavy maintenance. Although such solutions are less prevalent in the market currently, they are expected to be the next generation of wafer polishing and grinding equipment, over the forecast period.
Increasing Demand from Third Party Vendors
In the current market scenario, semiconductor companies are increasingly leaning toward distinguishing their products in new ways. In order to achieve this, many wafer vendors are in direct contact with downstream players to avoid any intermediate players. This is the biggest factors that helps achieve this differentiation. Association of huge companies, like companies Google, Amazon, Tesla, Microsoft, and AMD, and several major foundries in the market indicates the shift in market trends.
This trend is increasingly creating demand for polishing and grinding services rather than creating a direct demand for the equipment. Companies are increasingly preferring to outsource theses polishing and grinding operations, rather than procuring high priced semiconductor wafer polishing and grinding equipment and setting up highly complicated manufacturing establishments for their operations. This scenario is creating a demand for semiconductor wafer polishing and grinding equipment immensely from the third party manufacturers, who aim to benefit from the outsourcing activities of the key companies. Although the demand for these equipment is expected to grow at a very slow pace, in case of key players, considerably moderate consumption is expected from the third-party players over the forecast period.
Key Developments in the Market
• March 2021 – Precision Surfacing Solutions (formerly Lapmaster Wolters Group) announced that it has acquired REFORM Grinding Technology GmbH, a prominent provider of machine tools and systems for high-precision grinding applications. The acquisition of the REFORM brand is expected to increase Lampmaster’s precision grinding system portfolio and provide the ability to offer complimentary grinding technologies to their global customer base.
Major Players : APPLIED MATERIALS, EBARA, LAPMASTER, LOGITECH, ENTREPIX, REVASUM, TOKYO SEIMITSU, amongst others.
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Reasons to Purchase this Report:
- To examine the increased usage of Semiconductor Wafer Polishing and Grinding Equipment in Industry that affect the global market scenario
- Analyze various perspectives of the market with the help of Porter’s five forces analysis
- To know the modality and application that are expected to dominate the market
- To know the regions that are expected to witness fastest growth during the forecast period
- Identify the latest developments, market shares, and strategies employed by major market players
Customization of the Report:
- This report can be customized to meet your requirements. Please connect with our representative, who will ensure you get a report that suits your needs.
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Regional Analysis: –
– North America
– Asia-Pacific
– Europe
– South America
– Africa
Some Major Points from TOC: –
1. Introduction
1.1 Key Deliverables of the Study
1.2 Study Assumptions
1.3 Market Definition
1.4 Key Findings of the Study
2. Research Approach and Methodology
3. Executive Summary
4. Market Dynamics
4.1 Market Overview
4.2 Factors Driving the Market
4.2.1 Growing demand for semiconductors
4.3 Factors Restraining the Market
4.3.1 High equipments costs
4.4 Industry Attractiveness – Porter’s Five Forces Analysis
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Consumers
4.4.3 Threat of New Entrants
4.4.4 Threat of Substitute Products or Services
4.4.5 Competitive Rivalry among Existing Competitors
5. Global Semiconductor Wafer Polishing and Grinding Equipment Market Segmentation
5.1 By Equipment
5.1.1 Deposition
5.1.2 Lithography
5.1.3 Ion Implant
5.1.4 Etching and Cleaning
5.1.5 Others
5.2 By End User
5.2.1 Foundries
5.2.2 Memory Manufacturers
5.2.3 IDMs
5.2.4 Others
5.3 By Geography
5.3.1 North America
5.3.2 Europe
5.3.3 Asia-Pacific
5.3.4 Latin America
5.3.5 Middle East and Africa
6. Competitive Intelligence – Company Profiles
6.1 Applied Materials
6.2 EBARA
6.3 Lapmaster
6.4 Logitech
6.5 Entrepix
6.6 Revasum
6.7 TOKYO SEIMITSU
6.8 Logomatic
7. Investment Analysis
8. Outlook of the Semiconductor Wafer Polishing and Grinding Equipment MarketAAAA
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