A new study from Jeonbuk National University reports an improved way to design conductive polymer composites used in electronics. The researchers developed a fabrication strategy that reduces structural defects and enhances electrical and thermal performance, along with new models to help predict material behaviour.
Wearable tech
Modern portable and wearable electronic devices increasingly integrate high-performance components and wireless communication technologies. While this integration enhances device functionality, it also raises the risk of electromagnetic interference and heat accumulation.
As consumers press for devices of increased sophistication and a reduction in weight, circuit integration becomes challenging. The accumulative effects of electromagnetic interference and thermal build-up not only increase the likelihood of performance degradation and device malfunction, but they could also present a fire hazard.
Both of these physical forces can degrade device performance and reliability. As a result, there is growing industry demand for advanced materials capable of simultaneously managing electrical interference and dissipating heat efficiently.
Segregated conductive polymer composites
This includes segregated conductive polymer composites, which are attracting growing attention as electromagnetic shielding and thermal interface materials. However, a lack of theoretical models and micro-void formation during fabrication hinders their applicability.
Segregated conductive polymer composites (S-CPCs) are three-dimensional polymer materials that contain networks of conductive fillers concentrated along polymer boundaries, allowing them to achieve high electrical and thermal conductivity even with relatively small amounts of filler.
The new research presents a new fabrication strategy that minimises micro-void
formation while significantly improving electrical and thermal properties.
The South Korean scientists also developed new performance prediction models that could accelerate the future design of customised materials across multiple industries.
Research question: Improving material fabrication
The researchers set out to answer the question: “How can fabrication methods and predictive models be improved to enhance the electrical and thermal performance of segregated conductive polymer composites?”
Advancing thermal and electric properties
An optimized fabrication approach reduced micro-void formation and allowed more conductive filler to be added, significantly improving electrical and thermal conductivity in the composites.
The study combines a practical manufacturing strategy with new prediction models tailored to the unique structure of segregated composites. This approach could help accelerate the development of advanced materials for electromagnetic shielding and heat management in next-generation electronic and energy devices.
To mitigate the degradation in mechanical properties caused by micro-voids formed during the localisation of conductive networks at particle interfaces, the researchers developed a facile fabrication method involving the introduction of a terpolymer with a lower melting point than that of the base matrix. This approach significantly reduced micro-void formation, enabling the incorporation of additional filler. This meant both improved thermal and electrical conductivity.
Lead researcher Professor Seong Yun Kim tells Digital Journal in a message: “The materials developed in this study can be immediately utilised as next-generation EMI shielding and thermal management solutions.”
The study has been published in the journal Advanced Composites and Hybrid Materials, titled “Advanced percolation models incorporating excluded volume effects in segregated composites via nano-interconnection and micro-void structure optimization.”
