The Global Pin Fin Heat Sink Market for IGBT size was valued at USD 0.84 billion in 2019 and is predicted to reach USD 1.47 billion by 2030, with a CAGR of 5.2% from 2020-2030.
The report Pin Fin Heat Sink Market will function as a medium for the better assessment of the existing and future situations of the global market. It will be offering a 360-degree framework of the competitive landscape and dynamics of the market and related industries. Further, it entails the major competitors within the market as well as budding companies along with their comprehensive details such as market share on the basis of revenue, demand, high-quality product manufacturers, sales, and service providers. The report will also shed light on the numerous growth prospects dedicated to diverse industries, organizations, suppliers, and associations providing several services and products. The report will offer them buyers with detailed direction to the growth in market that would further provide them a competitive edge during the forecast period 2020 to 2030.
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The pin fin heat sink market for IGBT, is highly competitive and consists of various market players. Some of the major market players include Apex Microtechnology, Advanced Micro Devices (AMD), Advanced Thermal Solutions Inc., Aavid Thermalloy LLC (A thermal division of Boyd Corporation), CUI Inc., Allbrass Industrial the Brass, Honeywell International Inc., Kunshan Googe Metal Products Co. Ltd., and Comair Rotron, among others.
The key players are employing strategies such as product launches, acquisition, and technical collaboration, in-order to gain stronger position in the pin fin heat sink market for IGBT.
For instance, in July 2019, Boyd Corporation, a pioneer in the pin fin heat sink market for IGBT, announced the acquisition over Lytron Inc., a thermal management company specialized in manufacturing liquid coolants. This acquisition aimed at reinforcing Boyd’s monopoly in manufacturing liquid coolants for end-users like Aerospace industry, Healthcare industry, Electronics & Semiconductors, and other industry verticals; along with technology portfolio expansion in the chiller system solutions.
The major giants of thermal management solution providers in the pin fin heat sink market for IGBT, Advanced Thermal Solutions, Inc. (ATS), and Bisco industries, announced a new North American distribution partnership in October 2019, aiming to make available ATS thermal management products to the customers across North America, through the Bisco industry’s distribution network that is spread across 48 distribution channels in the U.S. and Canada,
In November 2019, one of the major players in the pin fin heat sink market for IGBT, Advanced Thermal Solutions Inc., introduced their ‘ultra-cool family’ of high-performance heat sinks, specially designed for cooling high-powered FPGAs, CPUs, GPUs, and AI processors. The heat sink featured an aluminium or copper straight fin base with a powerful blower mounted on its top. The unique fin pattern of the device is ideal for systems with open airflow from front to back. Where aluminium fins reduce the overall weight, copper fins convey heat more efficiently, enhancing the overall thermal performance.
In February 2020, the ruling market player in the pin fin heat sink market for IGBT, Honeywell International Inc., announced its cutting-edge cooling technology to provide thermal management solutions for electronic applications and data centers. Honeywell’s brand new ‘Solstice E-Cooling’ heat transfer agents, cool high-performance electronics and data centres using high-performance servers more efficiently, as compared to traditional cooling methods; offering greater efficiency, lower operational costs, and reduced environmental impact.
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North America demonstrates a mature market, and is expected to grow with a substantial market share in the global pin fin heat sink market for IGBT, throughout the forecast period. This is attributed to advancement in technologies, presence of key players, well-established industrial sector, as well as higher demand for efficient thermal management solutions in this region.
Asia Pacific is expected to demonstrate a tremendous growth, growing with the highest CAGR values in the global pin fin heat sink market for IGBT, throughout the forecast period. The market drivers are majorly; higher population ratios in this region, increase in per-capita disposable incomes, and rapid industrialization leading to increased manufacturing of consumer electronics and automotive, specifically in India and China.
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