Panel Level Packaging Market to Exceed US$ 8.5 Billion by 2033 as Demand for Portable, Ultra-thin Consumer Electronics Burgeons

PRESS RELEASE

Published March 20, 2023

In 2023, it is expected that the global panel level packaging market will be worth US$ 2.1 billion. By 2033, the market is projected to be worth about US$ 8.5 billion. It is anticipated to increase at an astounding rate of 14.9% CAGR from 2023 to 2033.

Manufacturers are pressuring their vendors to produce panel-processing tools and supplies so they may enable them to bring wafer-level precision to packed operations on panel substrates. It is projected that panel level packaging (PLP) would become a crucial packaging method in the next ten years.

This type of packaging is extensively used to package several components, including baseband, central processing unit (CPU), graphics processing unit (GPU), power management integrated circuit module, and field programmable gate array. The method lowers circuit packaging costs while increasing design flexibility.

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Key Takeaways from the Panel Level Packaging Market Study:

From 2018 to 2022, the panel level packaging market showed a historical CAGR of about 6%, which was rather significant.
By 2033, it is anticipated that the panel level packaging market in the USA will be worth US$ 1.4 billion.
The panel level packaging market in the United Kingdom is projected to surge at a 2% CAGR during the forecast period.
During the assessment period, South Korea is expected to generate an absolute dollar opportunity of around US$ 392.7 million.
The fan-out panel level packaging category is anticipated to increase at a CAGR of 8% by 2033, according to integration type.

“There is an increasing need to package numerous electronics components in a tiny area as integrated circuits technology advances. When creating portable, ultra-thin consumer electronics such as smartphones, smart devices, and smart watches, the technology is helpful. These are compact units that use less energy and have a variety of applications,” says a lead analyst at Future Market Insights.

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Competitive Landscape: Panel Level Packaging Market

With the big corporations present, the global panel level packaging market is extremely consolidated. These companies have generated substantial market share in the last five years. To produce competitive panel level packaging solutions, more companies will invest significantly in research & development, as well as market development initiatives during the next ten years.

A few key players in the global panel level packaging market are Amkor Technology Inc., Deca Technologies, Lam Research Corporation, ASE Group, Siliconware Precision Industries Co., Ltd., Fraunhofer Institute, SPTS Technologies, Stats ChipPac, Qualcomm Technologies, Samsung, and TSMC.

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For instance,

LB Semicon, an OSAT firm with its headquarters in South Korea, said in June 2022 that starting the following year, it will provide fan-out wafer level packaging solutions. This action aims to lessen the company’s reliance on the display driver integrated circuit dumping industry. The business provides testing services for application processors and complementary metal-oxide semiconductor image sensors.
The first electronic computer-aided design (ECAD) platform for 3D system design was released in October 2021 by a California-based company called Cadence. Building 3D stacked designs is anticipated to be done using the Cadence 3D-IC platform. This platform supports a variety of packaging arrangements, including 3D stacking, wafer-on-chip packaging, and fan-out wafer level packaging.
Samsung Electronics, a South Korea-based electronics maker, said in May 2021 that it would invest US$ 139.2 billion through 2030 on new manufacturing facilities, foundry operations, and system very large scale integration. The company’s foundry division will support cutting-edge technologies including high performance computing, 5G, and artificial intelligence.

Get More Valuable Insights into Panel Level Packaging Market

Future Market Insights, in its new offering, provides an unbiased analysis of the panel level packaging market presenting historical demand data (2018 to 2022) and forecast statistics for the period from 2023 to 2033. The study incorporates compelling insights on the panel level packaging market based on integration type (fan-in panel level packaging, fan-out panel level packaging), carrier type (200 mm, 300 mm, panel), end user (consumer electronics, IT & telecommunication, industrial, automotive, aerospace & defense, healthcare), and region.

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