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Eliyan Closes $40M Series A Funding Round and Unveils Industry’s Highest Performance Chiplet Interconnect Technologies

SANTA CLARA, Calif. – November 8, 2022 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced two major milestones in the commercialization of its technology for multi-die chiplet integration: the close of its Series A $40M funding round, and the successful tapeout of its technology on an industry standard 5-nanometer (nm) process.

To view the full announcement, including downloadable images, bios, and more, click here.

Key Takeaways:

  • Proven die-to-die interconnect scheme enables chiplets with standard packaging
  • Inventor of BoW technique raises $40M to commercialize technology for HPC, AI, HBM
  • Tapeout on 5nm process confirms bandwidth, power, latency advantages

Click image above to view full announcement.

About Tracker Capital Management
Tracker Capital Management was founded by Stephen A. Feinberg and Co-Chief Executive Officer of Cerberus Capital Management, L.P., as an independent investment vehicle focused on funding the development of emerging technologies.
About Intel Capital
Over three decades, Intel Capital has invested more than US $20 billion in the future of compute, funding standout, early-stage startups across four key areas of the tech ecosystem; Silicon, Frontier, Devices and Cloud. Intel Capital-funded companies have produced more than 700 IPOs and exits, and created more than US $100 billion in market value in the past 10 years. For more information, visit or follow @Intelcapital. Eliyan is part of Intel Capital’s Intel Foundry Services innovation fund. As a part of this effort, Eliyan and IFS will continue to evaluate opportunities to collaborate and drive adoption of Eliyan’s NuLink™ technology.
About Eliyan
Eliyan Corporation is leading the chiplet revolution, focusing on a fundamental challenge with scaling semiconductor performance, size, power, and cost to meet the needs of high-performance computing applications, from desktop to datacenter. It has developed a breakthrough method to enable the industry’s highest performing interconnect for homogenous and heterogenous multi-die architectures using standard packaging substrates, enabling increased sustainability through reduction in costs, manufacturing waste and power consumption. The company’s Bunch of Wires (BoW) technique, invented by founder Ramin Farjadrad and proven to increase performance by 2x and reduce power in half in advanced process technologies, provides a more efficient approach to developing chiplet-based architectures – which are the pathway to the continued scaling of Moore’s Law. The company has received initial funding from strategic investors, including Intel Capital and Micron Ventures, and venture capital firms Tracker Capital Managment and Celesta Capital. It is based in Santa Clara, California. More information can be found here.


Mike Sottak
[email protected]

Source: Eliyan

Distributed by: Reportable, Inc.

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