3D Semiconductor Packaging Market size is expected to grow at a CAGR of 15.8 % through 2021 to 2027, reaching nearly USD 38.49 Billion.
According to the Stellar Market research report “3D Semiconductor Packaging Market with COVID-19 Impact Analysis by Technology, Packaging Method, Industry Vertical and Region- Global Forecast to 2027”, the 3D Semiconductor Packaging market size is expected to grow from USD 38.49 billion in 2020 to USD 13.78 billion in 2027; it is expected to grow at a CAGR of 15.8 % from 2021 to 2027.
3D Semiconductor Packaging Market Outlook:
3D semiconductor packaging is an advanced semiconductor chip packing technology in which two or more layers of active electronic components are layered and connected vertically and horizontally to function as a single device. This method has a number of advantages over other advanced packaging technologies, including reduced space consumption, lower power loss, improved overall performance, and increased efficiency, making 3D semiconductor packaging the most advanced of all advanced packaging technologies.
The advantages of 3D semiconductor packaging over previous packaging methods, such as reduced cost, smaller size, and increased efficiency, are driving unprecedented growth in the 3D semiconductor packaging business. In 3D Via Silicon Via (TSV) technology, vertical connections are established through silicon die, resulting in a significant reduction in interconnect length when compared to 2D technology, which uses horizontal connections. High-end applications such as chips used in supercomputers, DRAMS, NAND, microelectronic circuits, and others benefit from the technological advantages of 3D packaging. Because of these benefits, the market for 3D semiconductor packaging has a lot of room to grow at a fast pace.
The 3D semiconductor packaging market is expected to develop due to rising demand for tablets, wearable devices, low-end smartphones, and other connected consumer goods, with key companies focusing on novel packaging methods. Silicon-Vias technology is used to integrate semiconductor technologies into microelectronic modules and stack thinner semiconductor chips in 3D semiconductor packaging. The demand for bandwidth for networking equipment and storage capacity is predicted to increase dramatically. For 3D IC manufacture, silicon on insulator wafers are favoured because they reduce unwanted heat production.
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3D Semiconductor Packaging Market Regional Insights:
In the semiconductor business, 3D Semiconductor Packaging is currently widely used, which has aided in the production of electronics products with long-term applications and lifespan. The Asia-Pacific region is one of the biggest buyers of consumer electronics in the world. 3D semiconductor packaging presents a significant growth opportunity for the region’s leading manufacturers. High semiconductor component production, a huge customer base for electronics products, high smartphone penetration among young people, and a robust semiconductor R&D pipeline are all projected to promote market growth in the near future.
3D Semiconductor Packaging Market Key Players:
Jiangsu Changjiang Electronics Technology Co. LTD (China)
Qualcomm Technology Inc. (United States)
Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan)
Siliconware Precision Industries Co., Ltd (SPIL) (Taiwan)
3M Company (United States)
Advanced Semiconductor Engineering (Taiwan)
United Microelectronics (Taiwan)
IBM (United States)
STMicroelectronics (Switzerland)
STATS ChipPAC (Singapore)
Micron Technology (United States)
Intel Corporation (United States)
Xilinx (United States)
Suss Microtec AG (Germany)
Amkor Technology Inc. (United States)
3D Semiconductor Packaging Market Segmentation:
Segmenting data allows clients to be more efficient in terms of time, money, and other resources. SMR clients can use market segmentation to better understand their customers. Client gains a better insight into their consumers’ needs and desires, allowing them to tailor campaigns to the customer segments most likely to purchase products.
By Technology
3D Wire Bonded
3D Through Silicon Via
3D Package on Package
3D Fan Out Based
By Packaging Method
Organic Substrate
Bonding Wire
Leadframe
Encapsulation
Resins
Ceramic Packages
Die Attach Material
By Industry Vertical
Electronics
Industrial
Automotive & Transport
Healthcare
IT & Telecommunication
Aerospace & Defense
By Region
North America
Europe
Asia Pacific
MENU
South America
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About Stellar Market Research:
Stellar Market Research, an India-based consulting and advisory company, was founded in 2018 with the goal of helping clients reach their business transformation goals through consulting services and strategic business planning. As a strategic knowledge partner, the company’s goal is to be an integral part of the client’s business. The firm makes recommendations to help shape future organizations. Since its establishment in November 2018, the company has been fully funded by revenue. To date, the company has worked with more than 335 companies in 25 industries to provide reliable data with 94% accuracy.
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