Original prototypes applied to the fields of health, automobiles,
aerospace, the environment, information technologies, and
communications for the electronic products of tomorrow.
BROMONT, QC, July 31, 2012 /CNW Telbec/ - The Université de Sherbrooke
and its industrial partners IBM and Teledyne DALSA officially
inaugurated today the Centre de Collaboration MiQro Innovation (C2MI),
which is now the largest microelectronics centre in Canada, especially
for its volume of high-tech equipment and infrastructure. The event was
held with the participation of Quebec Premier Jean Charest; the
Honourable Christian Paradis, federal Minister of Industry; the Mayor
of Bromont, Pauline Quinlan; and numerous other dignitaries.
Located in Bromont, Quebec, the C2MI enables the development and
production of prototypes for the health, automotive, aerospace,
environmental, information technology, and telecommunications fields.
The new entity is entirely dedicated to the research and development of
future generations of electronic products.
Destined to become a world leader in the development and assembly of
silicon chips and micro-electromechanical systems (MEMS), the C2MI
serves as an interface between university and industrial research to
accelerate the commercialization of the next generation of electronic
products. In addition to IBM and Teledyne DALSA, more than 70
industrial partners contributed to the establishment of this high-tech
Centre. These partners will continue their collaboration with the
Centre and with industrial and university colleagues to maintain the
infrastructure and equipment according to market needs.
"As a centre of collaboration, our role is to maintain a quality
environment conducive to research and to develop synergy between
complementary companies," explained Normand Bourbonnais, President and
CEO of the C2MI. "Companies that become active members have access to a
flexible infrastructure adapted to their needs, particularly for
developing innovative materials, testing prototypes, or validating
designs. We also work to maintain the list of industrial equipment at
the leading edge of technology, and we target companies that have a
strong potential for collaboration with active members, in Quebec,
Canada, and around the world."
The C2MI has 15 000 m2 of space and provides companies with multiple clean rooms, specialized
laboratories, technical services, and office space in two buildings
that belong to the Université de Sherbrooke. In addition to the
$83-million construction of the facility, there is an impressive array
of highly sophisticated equipment worth $135 million.
"At the heart of three of Quebec's major research areas, the Université
de Sherbrooke distinguishes itself particularly through open innovation
initiatives in cooperation with the industrial and social communities,"
said Rector Luce Samoisette. "The C2MI will enable the microelectronics
industry to overcome the challenges it faces around the world and will
be the place for major discoveries that lead to the development of new
technologies in fields as varied as health, telecommunications, and new
media."
The project benefited from financial support of $218.45 million from
partners and from the federal and provincial governments under the
Canada-Quebec Agreement of the Knowledge Infrastructure Program. The
C2MI is also recognized as a Centre of Excellence for Commercialization
and Research, which makes it eligible for operating subsidies granted
by the Networks of Centres of Excellence of Canada.
Through its avant-garde vision dating back to the 1960s, the City of
Bromont has fostered the development of its scientific park and
continues to contribute to it by locating the C2MI close to its IBM and
Teledyne DALSA partners. "The partnership agreement between the City of
Bromont and the Université de Sherbrooke, signed in 2008, was designed
to establish reciprocal collaboration in economic and industrial
development," said Pauline Quinlan, Mayor of Bromont and President of
the Bromont Economic Development Corporation. "The City and the
Corporation welcome the C2MI's arrival in Bromont's Technoparc. The
municipality's financial contribution is taking the form of a 10-year
tax break, representing $10 million. The Centre will help consolidate
businesses already established in the park and attract new companies."
Microelectronics: Everywhere in our homes
The C2MI is a major technological centre of scientific research and
experimental development for the microelectronics and microsystems
industry. "Strengthening the synergies between government,
universities, and industry fosters innovation and accelerates the
development of commercial products with global impact," said John Lutz,
President of IBM Canada. "This investment is an industry-building
initiative that will help the microelectronic packaging industry
adeptly meet tomorrow's demand. By infusing the C2MI with a high-value
skill set, our collaboration is working to ensure Quebec and Canada
will be able to continue to attract and retain top talent and remain at
the forefront of global innovation for years to come."
"MEMS (micro-electromechanical systems) are becoming a key technology
for almost every part of our lives," observed Brian Doody, CEO of
Teledyne DALSA. "From RF chips and orientation sensors for mobile
phones to optical cross-connects for telecom, chemical, and particulate
sensors for smoke detectors, and microfluidic devices for miniaturized
medical systems, integrated MEMS enable truly remarkable innovations
that reduce both size and power consumption of electronic devices even
as they improve performance."
About the Centre de collaboration MiQro Innovation
The C2MI is an original partnership between the Université de
Sherbrooke, Teledyne DALSA, and IBM. Located midway between Montreal
and Sherbrooke, the Centre is at the edge of the microelectronics
sector's emerging cluster within the Northeastern corridor. It intends
to revolutionize the packaging of the next generation of microchips
internationally. Its subsequent role is to produce 45- and 32-nanometre
microchips, develop chip cutting technologies, connect them
electrically to innovative packages, manage the heat dissipation, test
them, and prepare them for shipping.
SOURCE: UNIVERSITE DE SHERBROOKE
